Effect of Trace Zn Addition on Interfacial Evolution and Mechanical Properties of Sn-58Bi/Cu Solder Joints during Aging

被引：0
|
作者：
Wang F. [1 ]
He Q. [1 ]
机构：
[1] Materials Science and Engineering, Jiangsu University of Science and Technology, Zhenjiang
来源：
Jixie Gongcheng Xuebao/Journal of Mechanical Engineering | 2022年 / 58卷 / 02期
关键词：
Aging; Intermetallic compounds; Mechanical properties; Reliability; Sn-Bi solder;
D O I：
10.3901/JME.2022.02.284
中图分类号：
学科分类号：
摘要：
The effect of trace Zn addition on the growth of interfacial IMCs and the mechanical properties of Sn-58Bi solder joints under thermal aging were investigated. The results indicated that with minor Zn addition, the interfacial IMCs changed from Cu6Sn5 to Cu6(Sn, Zn)5. When the Zn content increased to 1.0 wt%, Cu5Zn8 phases were formed at the interface between Sn-58Bi-1.0Zn/Cu. The addition of Zn suppressed the growth of Cu3Sn IMCs during thermal aging. The sandwich structure of Cu6(Sn, Zn)5/Cu5Zn8/Cu6(Sn, Zn)5 IMCs was formed at the Sn-58Bi-0.5Zn/Cu interface after aging for 20 days. The shearing force of the solder joints decreased with the addition of Zn. However, the shearing force of Sn-58Bi-xZn solder joints were higher than that of the Sn-58Bi joints after a long time aging. The fracture mode of the solder joints changed from the ductile fracture to the mixed ductile-brittle fracture. It indicated that the long-time reliability of the solder joints was benefited from Zn addition. © 2022 Journal of Mechanical Engineering.
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页码：284 / 290
页数：6
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