Preparation and properties of latent moderate-temperature curing epoxy resin system

被引：0
|
作者：
Ding L. [1 ]
Yang J. [1 ]
Chen G. [1 ]
Li H. [1 ]
Su H. [1 ]
机构：
[1] Key Laboratory of Aerospace Advanced Materials and Performance, School of Materials Science and Engineering, Beihang University, Beijing
来源：
Yang, Jiping (jyang@buaa.edu.cn) | 1600年 / Beijing University of Aeronautics and Astronautics (BUAA)卷 / 34期
关键词：
Curing kinetics; Epoxy resin; Latent curing agent; Moderate-temperature curing; Modified dicyandiamide;
D O I：
10.13801/j.cnki.fhclxb.20161219.001
中图分类号：
学科分类号：
摘要：
Using a novel imidazole derivative EGE-2MI as latent accelerant for dicyandiamide-epoxy resin system, the curing behavior and the storage life of the system were investigated. The kinetics of curing reaction of the resin system were studied by DSC method, and optimum curing process parameters were determined. The storage life of the dicyandiamide-epoxy resin system at room temperature was evaluated by using DSC to measure the variation of the enthalpy at different storage time in ambient environment. And mechanical properties of the moderate-temperature curing products were also tested and analyzed. The results reveal that the dicyandiamide-epoxy resin systems with 0.6%-1.8% EGE-2MI content (content of epoxy resin as 100%) can be effectively cured at 115-125℃, the curing reaction activation energy of the resin system with 1.8% EGE-2MI content is 87.23 kJ/mol. The resin system is also chemically stable at room temperature, and has a storage life for over 35 days. Al-Al shear strength of cured system can reach 21.3 MPa, and its tensile strength is over 40 MPa. © 2017, Chinese Society for Composite Materials. All right reserved.
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页码：2150 / 2155
页数：5
相关论文
共 15 条
  • [1] Mozaffari S.M., Beheshty M.H., Mirabedini S.M., Microencapsulation of 1-methylimidazole using solid epoxy resin: Study on microcapsule residence time and properties of the system, Iranian Polymer Journal, 25, 4, pp. 385-394, (2016)
  • [2] Wu H., Xiao J., Xing S., Et al., Chemorheological characteristics of high-temperature resistant glycidylamineepoxy, Acta Materiae Compositae Sinica, 33, 4, pp. 741-748, (2016)
  • [3] Li G., Li B., Liu Y., Et al., Improved surface quality and hygrothermal performance of epoxy based prepreg by liquefied dicyandiamide with enhanced solubility and dispersibility, Materials & Design, 102, pp. 115-121, (2016)
  • [4] Liu X.D., Zhao C.H., Sudo A., Et al., Storage stability and curing behavior of epoxy-dicyandiamide systems with carbonyldiimidazole-Cu (II) complexes as the accelerator, Journal of Polymer Science Part A: Polymer Chemistry, 51, 16, pp. 3470-3476, (2013)
  • [5] Jiao J., Lan L., Ning R., Study on moderate temperature curing epoxy resin, Acta Materiae Compositae Sinica, 17, 2, pp. 8-11, (2000)
  • [6] Zhang O., Zhou W., Fu R., Et al., Study on curing kinetics of moderate temperature cured TDE-85/DICY/substituted urea system, Thermosetting Resin, 28, 3, pp. 10-14, (2013)
  • [7] Hayaty M., Honarkar H., Beheshty M.H., Curing behavior of dicyandiamide/epoxy resin system using different accelerators, Iranian Polymer Journal, 22, 8, pp. 591-598, (2013)
  • [8] Feng L., Wang Y., Wang Y., Et al., Study on reaction kinetics of epoxy resin cured by a modified dicyandiamide, Journal of Applied Polymer Science, 127, 3, pp. 1895-1900, (2013)
  • [9] Song Y., Dang M., Li S., Et al., Study on synthesis and properties of dicyandiamide curing agent modified by aniline, Chemistry and Adhesion, 1, (2012)
  • [10] Adhesives-Determination of tensile lap-shear strength of rigid-to-rigid bonded assemblies: GB/T 7124-2008, (2008)
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