Physical Simulation of Emulsion Phenomena in Copper Side-blown Smelting Process

被引：1
|
作者：
Li X.-L. [1 ]
Liu Y. [1 ]
Wang D.-X. [1 ]
Zhang T.-A. [1 ]
机构：
[1] Key Laboratory for Ecological Utilization of Multimetallic Mineral, Ministry of Education, Northeastern University, Shenyang
来源：
Liu, Yan (liuyan@smm.neu.edu.cn) | 2018年 / Northeast University卷 / 39期
关键词：
Copper; Emulsion; Interfacial area; Oxygen-enriched side-blown; Physical simulation; SMD of droplets;
D O I：
10.12068/j.issn.1005-3026.2018.05.009
中图分类号：
学科分类号：
摘要：
In order to quantitatively describe the emulsion phenomena, a physical model was built up based on the similarity law. Then a high-resolution camera and Image Pro-Plus 6.0 software were utilized to record the emulsion phenomena and analyze the effect of gas flow rate on the emulsified drops size distribution. Finally, an estimation method of the interfacial area ɑ was given. The results show that the Sauter mean diameter (SMD) of emulsified drops decreases with the increasing of gas flow rate. The interfacial area of emulsion layer almost linearly increases with the gas flow rate and the separation of matte and slag is caused by gravity and mass transfer. © 2018, Editorial Department of Journal of Northeastern University. All right reserved.
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页码：649 / 653
页数：4
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