Future material systems: Requirements and applications

被引:0
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作者
Kasper, Erich [1 ]
Müssig, Hans-Joachim [2 ]
Grimmeiss, Hermann G. [3 ]
机构
[1] Universitaet Stuttgart, Institut fuer Halbleitertechnik, Stuttgart, Germany
[2] IHP, Im Technologiepark 25, D-15236 Frankfurt (Oder), Germany
[3] University of Lund, Department of Solid State Physics, Box 118, S-22100 Lund, Sweden
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摘要
System-on-chip
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页码:17 / 26
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