Physical vapor deposition of hexagonal and tetragonal CuIn5Se8 thin films

被引:0
|
作者
Kohara, Naoki [1 ]
Nishiawaki, Shiro [1 ]
Negami, Takayuki [1 ]
Wada, Takahiro [2 ]
机构
[1] Adv. Technol. Research Laboratories, Matsushita Electric Ind. Co., Ltd., 3-4 Hikaridai, Seika-cho, Soraku-gun, Kyoto 619-0237, Japan
[2] Department of Materials Chemistry, Ryukoku University, 1-5 Yokotani, Ohe-cho, Seta, Otsu 520-2194, Japan
关键词
Copper compounds - Film growth - Lattice constants - Phase diagrams - Thin films - Vapor deposition;
D O I
10.1143/jjap.39.6316
中图分类号
学科分类号
摘要
Hexagonal and tetragonal CuIn5Se8 thin films have been successfully prepared by physical vapor deposition. A hexagonal CuIn5Se8 thin film was obtained via the reaction of (Cu+Se) and (In+Se) layers. This hexagonal film had a layered structure with a lattice spacing of approximately 16 angstroms, corresponding to fivefold close-packed stacking of Se. With an alternative deposition process using (CuInSe2) and (In2Se3) layers, a tetragonal CuIn5Se8 thin film was obtained. The tetragonal film had a columnar structure with a lattice spacing of 3.3 angstroms, corresponding to the cubic close-packed stacking of Se. As evident from examination of the Cu2Se-In2Se3 pseudo-binary system phase diagram, hexagonal CuIn5Se8 is a stable phase and tetragonal CuIn5Se8 is metastable. The growth mechanism of the hexagonal and tetragonal phase CuIn5Se8 thin films is discussed from a crystallographic point of view.
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页码:6316 / 6320
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