Investigation of the warpage modeling technique for thick multi-chip module encapsulated by compression molding

被引：0
|
作者：
机构：
[1] Suzuki, Kosuke
[2] Sanada, Yuki
[3] Uchibori, Shinya
[4] Kashiwazaki, Atsushi
[5] Imada, Masaji
来源：
| 2017年 / Institute of Electrical and Electronics Engineers Inc., United States卷
关键词：
D O I：
7939379
中图分类号：
学科分类号：
摘要：
Printed circuit boards
引用
收藏
相关论文
共 50 条
  • [1] Investigation of the warpage modeling technique for thick multi-chip module encapsulated by compression molding
    Suzuki, Kosuke
    Sanada, Yuki
    Uchibori, Shinya
    Kashiwazaki, Atsushi
    Imada, Masaji
    2017 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP), 2017, : 297 - 301
  • [2] Investigation of the Factors Affecting the Warpage Prediction of Multi-Chip Package
    Rajmane, Pavan
    Dhandapani, Karthikeyan
    Schwarz, Mark
    Syed, Ahmer
    IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), 2021, : 1514 - 1520
  • [3] Multi-chip module
    Zhang, Hongnan
    Sun, Lining
    Hunan Daxue Xuebao/Journal of Hunan University Natural Sciences, 25 (01): : 60 - 65
  • [4] MULTI-CHIP MODULE USING COPPER THICK FILM.
    Ikehata, Masao
    Iguchi, Yasuo
    Arao, Yoshinori
    Shibata, Isao
    Nihei, Koji
    International Journal of Microcircuits and Electronic Packaging, 1984, 7 (02): : 35 - 39
  • [5] MULTI-CHIP MODULE TECHNOLOGY
    RINNE, RA
    BARBOUR, DR
    ELECTROCOMPONENT SCIENCE AND TECHNOLOGY, 1982, 10 (01): : 31 - 49
  • [6] Warpage and reliability of three-dimensional multi-chip module with high density embedded substrate
    Xu, Gaowei
    Zhou, Jian
    Luo, Le
    ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2007, : 701 - 707
  • [7] A multi-chip module for physics experiments
    Benso, A
    Chiusano, S
    Giovannetti, S
    Mariani, R
    Motto, S
    Prinetto, P
    1999 INTERNATIONAL CONFERENCE ON HIGH DENSITY PACKAGING AND MCMS, PROCEEDINGS, 1999, 3830 : 108 - 113
  • [8] New polyimide for multi-chip module
    Saito, T.
    Kikuchi, T.
    Sato, H.
    Integration of Fundamental Polymer Science and Technology, 1991,
  • [9] Multi-chip power module fast thermal modeling for layout optimization
    Shook, Brett W.
    Gong, Zihao
    Feng, Yongfeng
    Francis, A. Matthew
    Mantooth, H. Alan
    Computer-Aided Design and Applications, 2012, 9 (06): : 837 - 846
  • [10] Faulty chip identification in a multi-chip module system
    Damarla, TR
    Chung, MJ
    Su, W
    Michael, GT
    14TH IEEE VLSI TEST SYMPOSIUM, PROCEEDINGS, 1996, : 254 - 259
12345