Computer simulation for thermal conductivity of copper thin film with homogenous non-equilibrium molecular dynamics

In order to study supernormal heat transfer of thin films in microelectronic devices, the authors, based on isothermal linear response theory (LRT) and embedded atom method (EAM) potential, studied thermal conductivity of copper thin films using homogeneous non-equilibrium molecular dynamics (NEMD). The relations between thermal conductivity of copper thin films and their thickness as well as temperatures were extracted. The results observe Flik regime on microscale heat transfer and are in good agreement with the experimental data from other literature. The method and results of this paper can be used to analyze microscale heat transfer and thermal stress in microelectronic devices.