Characterization and simulation on the cure behavior of epoxy resin for encapsulation structure

被引：0
|
作者：
Ding, Anxin [1 ]
Yu, Xingchen [1 ]
Yang, Peng [2 ]
Kang, Junming [1 ]
Ni, Aiqing [1 ]
Wang, Jihui [1 ]
Li, Xiaoyang [2 ]
机构：
[1] School of Materials Science and Engineering, Wuhan University of Technology, Wuhan,430070, China
[2] Institute of Electronic Engineering, China Academy of Engineering Physics, Mianyang,621900, China
来源：
Fuhe Cailiao Xuebao/Acta Materiae Compositae Sinica | 2022年 / 39卷 / 04期
关键词：
Epoxy resins;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：1824 / 1833
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