Meeting the challenge of film frame handling automation

Semiconductor and LED manufacturers are interested in automating the film frame handling process as a means to increase throughput and yield in their BEOL processes. Film frames are typically used in back-end-of-line (BEOL) operations in the LED and semiconductor industries to contain substrates that will eventually be diced or scribed and then split apart. The frame holds a sticky film that keeps the separated dice or LEDs in a manageable array after they have been separated into individual components. In semiconductor applications, the film frame can be used to stretch the film to make it easier to pick up individual dice for BEOL test and binning applications. The LED industry has been expanding into a wide variety of applications, including aviation and automotive lighting, household appliances, remote controls for electronic systems, television backlighting, traffic systems and even household lighting.