Stop the leaks!

被引：0

作者：

Munson, T. ^{[1
]}

机构：

[1] CSL, Kokomo, IN, United States

来源：

| 2001年 / Miller Freedman Inc.卷 / 24期

关键词：

Flame retardants - Impurities - Integrated circuit manufacture - Negative ions - Positive ions - Soldering - Surface cleaning;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

The effects of surface and absorbed fabrication residues on an assembler for electric leakage were examined. The integrated circuit analysis for the soldermasked FR-4 boards was carried out. The results showed that inconsistent performance during burn-in-testing were mainly due to the presence of anion and cation residues on bare boards and incomplete board cleaniness that left high levels of chlorides. A remedial cleaning process was recommended for the burn-in-leakage problems.

引用

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