Simulation modeling of wafer grinding surface roughness considering grinding vibration

被引：0
|
作者：
Li, Meng [1 ]
Zhu, Xianglong [1 ]
Kang, Renke [1 ]
Li, Jiasheng [1 ]
Xu, Jiahui [1 ]
Li, Tianyu [1 ]
机构：
[1] State Key Laboratory of High-Performance Precision Manufacturing, Dalian University of Technology, Dalian,116024, China
来源：
Precision Engineering | 2024年 / 91卷
基金：
中国国家自然科学基金;
关键词：
Gear teeth - Grinding wheels - Vibration analysis;
D O I：
10.1016/j.precisioneng.2024.09.002
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：278 / 289
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