Analysis of crosstalk of the BGA Solder Joint on Memory chip based on HFSS

被引：0
|
作者：
Huang G. [1 ]
Huang C. [1 ]
Lu L. [1 ]
Liang Y. [2 ]
Li T. [3 ]
Huang W. [1 ]
机构：
[1] School of Electro-Mechanical Engineering, Guilin University of Electronic Technology, Guilin
[2] Department of Electronic Engineering, Chengdu Aeronautic Vocational and Technical College, Chengdu
[3] Department of Automobile and Power Engineering, Guilin University of Aerospace Technology, Guilin
来源：
Huang, Chunyue (hcymail@163.com) | 2018年 / Harbin Research Institute of Welding卷 / 39期
关键词：
BGA solder joint; Orthogonal experiment; Range analysis; The far end crosstalk; The near end crosstalk;
D O I：
10.12073/j.hjxb.2018390146
中图分类号：
学科分类号：
摘要：
The HFSS crosstalk simulation analysis model of BGA(Ball Grid Array) solder joints on memory chip was developed. The near and far crosstalk simulation results were obtained by analyzing crosstalk of two BGA solder joints under the high-frequency condition based on the model. The impacts of signal frequency, solder joint maximum radial size and solder joint height on crosstalk were also studied. By using orthogonal experiment design method, the far end crosstalk analysis of BGA solder joints which had 16 different process parameters levels combinations was performed. Studying results showed that the far end crosstalk increased as the signal frequency, the maximum radial size of the solder joint and the height of solder joint increased. When confidence was 90%, maximum radial size of solder joint had significant effect on the far end crosstalk of BGA solder joints, the solder joint height and the signal frequency size had less effect on the far end crosstalk of BGA solder joints. © 2018, Editorial Board of Transactions of the China Welding Institution, Magazine Agency Welding. All right reserved.
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页码：43 / 46
页数：3
相关论文
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