Diffusion layer growth kinetics model of copper hot-dipping aluminum coating

被引：0
|
作者：
Wang, Zheng [1 ]
Liu, Ping [1 ,2 ]
Liu, Xin-Kuan [2 ]
Chen, Xiao-Hong [2 ]
He, Dai-Hua [2 ]
Ma, Feng-Cang [2 ]
机构：
[1] School of Mechanical Engineering, University of Shanghai for Science and Technology, Shanghai, China
[2] School of Materials Science and Engineering, University of Shanghai for Science and Technology, Shanghai, China
来源：
Gongneng Cailiao/Journal of Functional Materials | 2015年 / 46卷 / 02期
关键词：
D O I：
10.3969/j.issn.1001-9731.2015.02.017
中图分类号：
学科分类号：
摘要：
16
引用
收藏
页码：02080 / 02083
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