Signal integrity;Practical EBG application to multilayer PCB: impact on power integrity

被引：16

作者：

De Paulis, F. ^{[1
]}

Nisanci, M.H. ^{[1
]}

Orlandi, A. ^{[2
]}

Fan, Jun ^{[2
]}

机构：

[1] University of L'Aquila, L'Aquila, Italy

[2] UAq EMC Laboratory, United States

来源：

IEEE Electromagnetic Compatibility Magazine | 2012年 / 1卷 / 03期

关键词：

21;

D O I：

10.1109/MEMC.2012.6347053

中图分类号：

学科分类号：

摘要：

引用

页码：60 / 65

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