Application of hull cell for high-speed Tin plating solution

被引：0

作者：

Li, De-Yu ^{[1
]}

Zhao, Zi-Wei ^{[1
]}

Kong, De-Long ^{[1
]}

Li, Ning ^{[1
]}

Wu, Gang ^{[2
]}

机构：

[1] School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Heilongjiang,150001, China

[2] Department of Chemical and Biological Engineering, University at Buffalo, The State University of New York, Buffalo,New York,14260, United States

来源：

Surface Technology | 2018年 / 47卷 / 11期

关键词：

Coatings - Crystal orientation - Current density - Electrodes - Electrolytes - Electroplating - Flow rate - Rotating disks - Scanning electron microscopy - Speed - X ray diffraction analysis;

D O I：

10.16490/j.cnki.issn.1001-3660.2018.11.034

中图分类号：

学科分类号：

摘要：

引用

页码：239 / 244

共 50 条

[1] HIGH-SPEED TIN AND SOLDER PLATING
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