FEM analysis of stress distribution in metal/ceramic multi-layer composites prepared by EBPVD technique

被引:0
|
作者
Ctr. for Compos. Mat. and Structures, Harbin Institute of Technology, Harbin, 150001, China [1 ]
机构
来源
关键词
D O I
May 16, 2004 - May 20, 2004
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [1] In-situ Stress Analysis of Nickel Nanoparticle Sintering with Metal Additive in Multi-Layer Ceramic Capacitors
    Jung, Youngran
    Joo, Wonhyo
    Lee, Kyung Rul
    Kim, Cheol
    Choi, Min-Jung
    Joo, Young-Chang
    Lee, So-Yeon
    ELECTRONIC MATERIALS LETTERS, 2025,
  • [2] Investigation and Analysis of Cracks in Multi-layer Ceramic Capacitor
    Lee, Chul-Seung
    Kang, Byung Sung
    Hur, Kang Heon
    Park, Jin Woo
    JOURNAL OF THE KOREAN CERAMIC SOCIETY, 2009, 46 (02) : 211 - 218
  • [3] Analysis of the residual stress in multi-layer materials
    Shi, Kun
    Yuan, Yuan
    Wei, Fengtao
    ADVANCES IN INTELLIGENT STRUCTURE AND VIBRATION CONTROL, 2012, 160 : 377 - 380
  • [4] FEM analysis on singular stress field of ceramic/metal joint
    Luo, Fangyi
    Kobayashi, Hideo
    Nakamura, Haruo
    Sato, Takuya
    Nippon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A, 1994, 60 (577): : 1935 - 1942
  • [5] Multi-layer film metallization of AlN ceramic and its sealing to metal
    Lu, YP
    FUNCTIONALLY GRADED MATERIALS VII, 2003, 423-4 : 297 - 300
  • [6] Defects of base metal electrode layers in multi-layer ceramic capacitor
    Yu, BY
    Wei, WCJ
    JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 2005, 88 (08) : 2328 - 2331
  • [7] Effect of margin widths on the residual stress in a multi-layer ceramic capacitor
    Park, Jong-Sung
    Shin, Hyunho
    Hong, Kug Sun
    Jung, Hyun Suk
    Lee, Jung-Kun
    Rhee, Kyong-Yop
    MICROELECTRONIC ENGINEERING, 2006, 83 (11-12) : 2558 - 2563
  • [8] Comparative Analysis of Pad Geometries Used for Multi-Layer Ceramic Capacitors in Power Distribution Networks
    Petre, Adrian-Razvan
    Drumea, A.
    Pantazica, M.
    Marghescu, C., I
    2020 IEEE 26TH INTERNATIONAL SYMPOSIUM FOR DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING (SIITME 2020), 2020, : 434 - 439
  • [9] A new method for evaluating thermal compatibility of multi-layer dental ceramic composites
    Cui, J.
    Ou, J.
    Chao, Y. L.
    Gao, Q. P.
    Yin, G. F.
    Wang, H.
    Shen, J. F.
    Chen, Y.
    BIOCERAMICS, VOL 19, PTS 1 AND 2, 2007, 330-332 : 1401 - +
  • [10] The behavior of ionic polymer-metal composites in a multi-layer configuration
    Paquette, JW
    Kim, KJ
    Kim, D
    Yim, W
    SMART MATERIALS AND STRUCTURES, 2005, 14 (05) : 881 - 888