A Study on Evaluation of the Copper Ion Electrochemical Migration Inner the Multilayer Flexible Circuit Board

被引：0
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作者：
Li, Xiaoqian [1 ]
Wang, Yang [1 ]
Hong, Shaolong [1 ]
Zhang, Xuan [1 ]
机构：
[1] Reliability Research and Analysis Center Ceprei (East China), Suzhou, China
来源：
2024 25th International Conference on Electronic Packaging Technology, ICEPT 2024 | 2024年
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Compendex;
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摘要：
Electrolytic cells
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