Prediction of CMP Polishing Material Removal Rate of Semiconductor Wafers Based on Multi-source Data Fusion

被引：0

作者：

Fang, Wei ^{[1
]}

Wang, Yuyu ^{[1
]}

Song, Zhilong ^{[1
]}

Lyu, Binghai ^{[1
]}

Zhao, Wenhong ^{[1
]}

机构：

[1] College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou,310023, China

来源：

Surface Technology | 2024年 / 53卷 / 02期

关键词：

Compendex;

D O I：

10.16490/j.cnki.issn.1001-3660.2024.02.014

中图分类号：

学科分类号：

摘要：

Data reduction - Deep neural networks - Forecasting - Learning systems - Modal analysis - Network coding - Network layers - Regression analysis - Sensor data fusion - Silicon wafers

引用

页码：150 / 157

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