Mathematical Modelling on Thermal Conductivity of Silicone Rubber Micro Nanocomposites by including Agglomeration Effect

被引:0
|
作者
Vinod P. [1 ]
Babu M.S. [1 ]
Danikas M.G. [2 ]
Kornhuber S. [3 ]
Sarathi R. [1 ]
机构
[1] Department of Electrical Engineering, IIT Madras, Chennai
[2] Department of Electrical & Computer Engineering, Democritus University of Thrace, Xanthi
[3] Department for High Voltage Engineering, University of Applied Sciences, Zittau/Görlitz, Zittau
关键词
Agglomerations; alumina; ATH; silicone rubber; thermal conductivity;
D O I
10.25103/JESTR.147.06
中图分类号
学科分类号
摘要
Silicone rubber (SR) micro nanocomposites are prepared by reinforcing the base SR insulating material with two different fillers (micro ATH and nano-alumina), in order to improve the electrical, thermal, and mechanical characteristics of SR material. Micro ATH fillers are cost-effective and enhance the resistance towards electrical discharges, whereas the inclusion of nano-alumina fillers improve the thermal conductivity of the composite material. To evaluate the thermal conductivity of polymer composites theoretically, a number of mathematical models have been developed. The thermal conductivity of polymer composites with hybrid fillers can be determined theoretically using Agrawal’s model. The present research focuses on determining the effective thermal conductivity of silicone rubber micro nanocomposites while taking into account important factors such as the hybrid fillers with unequal sizes and also considering the agglomeration concept. The volume fraction of aggregated nano-alumina fillers is noticed to increase significantly with increment in the weight percentage of nano-alumina fillers. In comparison to Agrawal’s model, the modified thermal conductivity model mentioned in the current research work has provided lesser error with respect to experimental data. © 2022
引用
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页码:35 / 40
页数:5
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