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- [2] SPC system analysis and design of reflow soldering process ICEPT: 2006 7TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2006, : 381 - +
- [5] Improving Monitoring Accuracy of process Based on SPC Method PROCEEDINGS OF THE 2012 24TH CHINESE CONTROL AND DECISION CONFERENCE (CCDC), 2012, : 1488 - 1491
- [6] Managing and Improving the Drilling Process of Woodwork Furniture with the Use of SPC Tools MANUFACTURING TECHNOLOGY, 2021, 21 (04): : 492 - 501
- [8] Improving the reliability of the plastic IC package in reflow soldering process by optimization IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2004, 27 (02): : 352 - 358
- [9] On Reflow Soldering Process and Reflow Profile 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 865 - 870
- [10] Improving SPC in a wafer fabrication environment TWENTY THIRD IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM, 1998, : 346 - 351