Effect of La on nano mechanical properties of Sn-0.3Ag-0.7Cu reflow solder joints

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作者：
College of Materials Science and Engineering, Harbin University of Science and Technology, Harbin [1 ]
150040, China
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来源：
Hanjie Xuebao | / 9卷 / 75-78期
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Compilation and indexing terms; Copyright 2024 Elsevier Inc;
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摘要：
Inverse problems - Silver alloys - Copper alloys - Hardness - Ternary alloys - Elastic moduli - Soldering - Lead-free solders - Rare earths - Strain rate - Alcohols - Creep resistance
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