NONDESTRUCTIVE DEFECT DETECTION IN 3D X-RAY MICROSCOPY DATA OF BALL GRID ARRAY SOLDER FOR VOID DETECTION IN SOLDER JOINTS USING DEEP LEARNING

被引：0
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作者：
Rathod, Kishansinh [1 ]
Desapogu, Sankeerth [1 ]
Jansche, Andreas [1 ]
Bernthaler, Timo [1 ]
Braun, Daniel [2 ]
Diez, Stephan [2 ]
Schneider, Gerhard [1 ]
机构：
[1] Materials Research Institute – Aalen University, Aalen, Germany
[2] BMW AG, Munich, Germany
来源：
Electronic Device Failure Analysis | 2024年 / 26卷 / 03期
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D O I：
10.31399/asm.edfa.2024-3.p004
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页码：4 / 11
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