Formulation development and bonding performance of epoxy resin film

被引：0
|
作者：
Li Y. [1 ]
Chen H. [2 ]
Liang J.-C. [1 ]
Yu K.-F. [1 ]
机构：
[1] College of Materials Science and Engineering, Jilin University, Changchun
[2] Xuzhou XCMG Road Construction Machinery Co., Ltd., Xuzhou
来源：
Jilin Daxue Xuebao (Gongxueban)/Journal of Jilin University (Engineering and Technology Edition) | 2022年 / 52卷 / 05期
关键词：
Bonding performance; Composite material; Epoxy resin; Film adhesive; Oxazolidinone;
D O I：
10.13229/j.cnki.jdxbgxb20200964
中图分类号：
学科分类号：
摘要：
Toluene diisocyanate (TDI) was used to chemically modify the phenolic epoxy resin (EPN), and a flexible oxazolidinone ring structure was introduced into the resin matrix. The effects of imidazole curing agent (MZ), basalt fiber (BF), polyethersulfone (PES), and aluminum powder on the adhesive properties of the film were explored. The synthesis of the oxazolidinone ring was characterized by Fourier infrared spectroscopy and nuclear magnetic resonance spectroscopy, the toughening mechanism was studied by scanning electron microscopy (SEM), and the curing process of the film and its thermal stability was studied by thermogravimetry (TGA).The lap shear and drum peeling tests proved that the toughening agent improved the adhesive performance of the film. The shear strength and average drum peel strength reached 25.675 MPa and 47 (N·mm)/mm, and the film had excellent heat stability, the T5 temperature under air and nitrogen reached 337.18 ℃ and 364.95 ℃. © 2022, Jilin University Press. All right reserved.
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页码：1022 / 1029
页数：7
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