Behavior of debinding and sintering in micron and submicron-sized copper powder injection molded parts

被引：0
|
作者：
Nishiyabu, Kazuaki [1 ]
Tanabe, Daiki [1 ]
Kanoko, Yasuhiro [1 ]
Tanaka, Shigeo [1 ]
机构：
[1] Nishiyabu, Kazuaki
[2] Tanabe, Daiki
[3] Kanoko, Yasuhiro
[4] Tanaka, Shigeo
来源：
| 1600年 / Japan Society of Mechanical Engineers卷 / 79期
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D O I：
10.1299/kikaia.79.1593
中图分类号：
学科分类号：
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页码：1593 / 1603
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