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- [2] Investigating Hole Filling in Pin-in-Paste Technology for Vapour Phase Soldering 2013 IEEE 19TH INTERNATIONAL SYMPOSIUM FOR DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING (SIITME), 2013, : 59 - 64
- [3] Investigating the effect of large SMD components on heating during vapour phase soldering 2017 IEEE 23RD INTERNATIONAL SYMPOSIUM FOR DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING (SIITME), 2017, : 44 - 49
- [4] PROTECTIVE EFFECTS OF VAPOUR PHASE CORROSION INHIBITORS TESTED IN LABORATORY CONDITIONS METALURGIJA, 2023, 62 (3-4): : 405 - 408
- [6] VAPOUR-FLOW METHOD FOR INVESTIGATING SPECTRA OF ELECTRON PARAMAGNETIC RESONANCE OF FREE RADICALS IN HETEROGENEOUS CONDITIONS BIOPHYSICS-USSR, 1963, 8 (06): : 783 - &
- [10] Investigating shadowing and possible tombstoning caused by large SMD components during vapour phase reflow soldering 2019 IEEE 25TH INTERNATIONAL SYMPOSIUM FOR DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING (SIITME 2019), 2019, : 343 - 346