Surface Plating of Supper High Thermal Diamond/Copper Composite Material

被引：0

作者：

Ji X. ^{[1
]}

He G. ^{[1
]}

机构：

[1] The 29th Research Institute of China Electronics Technology Group Corporation, Chengdu

来源：

| 2017年 / Editorial Office of Chinese Journal of Rare Metals卷 / 41期

关键词：

Coarsening; Diamond copper; GaN chip; Plating; Weldability;

D O I：

10.13373/j.cnki.cjrm.XY16070029

中图分类号：

学科分类号：

摘要：

The diamond/Cu composite with high thermal conductivity and low thermal expansion coefficient could be gallium nitrogen (GaN) and silicon carbon (SiC) high power chip cooling heat sink in the microelectronic. The diamond/Cu could reduce the high power chip junction temperature and improve the electronic product life and reliability. By means of electroless nickel gold plating on the surface of diamond copper composite material, the surface metallization was improved. The surface of the un-treatment diamond was very smooth and could not be electroplated by any metal. The diamond was very inactive, and could not be coarsened by acid and alkali, however copper was very active and was easily to erode excessive. Nitric acid, vitriol, sodium hydroxide, eject sand, polish were used, which could not roughen diamond. According to diamond copper material properties, JG-01 could coarsen diamond effectively, the novel coarsening could not erode copper. JG-01 formed continuous honeycomb micropore on the surface of diamond/Cu composites, it could advance the adhesion of surface of diamond. After coarsening, through activation, sensitizing, electroless nickel, plating gold and etc, the nickel and gold plating satisfied heat shock test and high temperature baking, the gold plating covery rate was up to chip 100%, significantly reduced the surface roughness, and the weldability of gold tin and lead tin solder satisfied product requirements. © Editorial Office of Chinese Journal of Rare Metals. All right reserved.

引用

页码：659 / 664

页数：5

共 16 条

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