Preparation and characterization of surface modified boron nitride/diamond polyimide composites with enhanced thermal conductivity

被引：0
|
作者：
Yang N. [1 ]
Wang N. [1 ]
Yao Y. [1 ]
Pan Z. [2 ]
Qu X. [1 ]
机构：
[1] Institute of Polymer Science and Engineering, Hebei University of Technology, Tianjin
[2] Chengde Petroleum College, Chengde
来源：
Qu, Xiongwei (xwqu@hebut.edu.cn) | 2017年 / Sichuan University卷 / 33期
关键词：
Boron nitride; Nano-diamond; Polyimide; Synergistic effect; Thermal conductivity;
D O I：
10.16865/j.cnki.1000-7555.2017.01.028
中图分类号：
学科分类号：
摘要：
A novel kind of thermally conductive and outstanding insulation composite was prepared using the mixture of 2-D micro-scale hexagonal boron nitride (h-BN) and 3-D nano-scale diamond (ND) hybrid fillers on the matrix of polyimide (PI) by in-situ polymerization. In order to improve the interfacial compatibility between the inorganic filler and the polymer matrix, BN fillers were functionalized with aromatic polyamide (HBP) and ND particles with 4, 4'-oxybisbenzenamine (ODA). The structure and properties of the composites were characterized by scanning electron microscopy (SEM), thermo-gravimetric analysis (TGA) and thermally conductive instrument. The results indicate that the thermal conductivity of the composite can be enhanced with different sizes and types of the fillers, because of increasing the packing density, reducing the interfacial thermal resistance and forming thermal conductive networks. When the filler content is 30% with the HBP-BN and ND-ODA mass ratio of 9: 1, the thermal conductivity of the composite is 0.596 W/(m·K), 3.5 times higher than that of the neat PI. Meanwhile, the composites fabricated possess excellent electrical insulation and thermal stability, and may be appropriate for application of the electronic materials. © 2017, Editorial Board of Polymer Materials Science & Engineering. All right reserved.
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页码：153 / 157
页数：4
相关论文
共 11 条
  • [1] Qin L.L., Wang Z.J., Hou J., Et al., Advances in insulating thermal conductive composite filled with BN, Polymer Materials Science & Engineering, 29, 9, pp. 175-178, (2013)
  • [2] Shoichi K., Yamada I., Koji W., Et al., High-thermal-conductivity AlN filler for polymer/ceramics composites, J. Am. Ceram. Soc., 92, pp. S153-S156, (2009)
  • [3] Wattanakul K., Manuspiya H., Yanumet N., Effective surface treatments for enhancing the thermal conductivity of BN-filled epoxy composite, J. Appl. Polym. Sci., 119, pp. 3234-3243, (2011)
  • [4] Han Z., Fina A., Thermal conductivity of carbon nanotubes and their polymer nanocomposites: a review, Prog. Polym. Sci., 7, pp. 914-944, (2011)
  • [5] Ghosh S., Bao W., Nika D.L., Et al., Dimensional crossover of thermal transport in few-layer grapheme, Nat. Mater., 9, pp. 555-558, (2010)
  • [6] Che J., Cag1n T., Deng W., Et al., Thermal conductivity of diamond and related materials from molecular dynamics simulations, J. Chem. Phys., 113, pp. 6888-6900, (2000)
  • [7] Zhou T., Wang X., Liu X., Et al., Improved thermal conductivity of epoxy composites using a hybrid multi-walled carbon nanotube/micro-SiC filler, Carbon, 48, pp. 1171-1176, (2010)
  • [8] Li M., Zhang K., Yang W.B., Et al., Synergistic improvement of thermal conductivity of thermally conductive and insulating BN/SiCw/polysulfone composites, Polymer Materials Science & Engineering, 31, 4, pp. 73-77, (2015)
  • [9] Ying Y., Min Z.R., Ming Q.Z., Grafting of hyperbranched aromatic polyamide onto silica nanoparticles, Polymer, 51, pp. 492-499, (2010)
  • [10] Hou J., Li G.H., Yang N., Et al., Preparation and characterization of surface modified boron nitride epoxy composites with enhanced thermal conductivity, RSC Adv., 83, pp. 44282-44290, (2014)
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