Electroplating. Micro-encapsulating in electroplating

被引：0

作者：

Dietz, Andreas ^{[1
]}

Jobmann, Monika ^{[1
]}

Rafler, Gerald ^{[1
]}

机构：

[1] Fraunhofer-Inst. Schicht-/O., Hamburg, Germany

来源：

MO Metalloberflache Beschichten von Metall und Kunststoff | 2000年 / 54卷 / 01期

关键词：

Wear detection;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

引用

页码：28 / 30

共 50 条

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Anon
1600, (51):
[2] The chemistry of electroplating.
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JOURNAL OF THE FRANKLIN INSTITUTE, 1905, 160 : 139 - 146
[3] Microcomputers in Electroplating.
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Galvanotechnik, 1983, 74 (05): : 538 - 540
[4] Advances in Electroplating.
Tostmann, K.H.
Galvanotechnik, 1974, 65 (05): : 363 - 374
[5] JOINING BY ELECTROPLATING.
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1600, (14):
[6] Electroplating. New working principle in the electroplating of plastics
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[7] A simple method of electroplating.
不详
NATURE, 1910, 82 : 461 - 462
[8] PHYSICAL CONDITIONING OF ELECTROPLATING.
Evans, Peter
Product Finishing (London), 1981, 34 (09): : 45 - 46
[9] Recent Developments in Electroplating.
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Galvanotechnik, 1987, 78 (03): : 642 - 648
[10] Process Control in Electroplating.
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