Sn-Bi-In Alloy Solder and Foundation of Phase Diagram Calculation

被引：0
|
作者：
Li W. [1 ]
Li M. [1 ]
Bu H. [1 ]
机构：
[1] Faculty of Material Science and Engineering, Kunming University of Science and Technology, Kunming
来源：
Xiyou Jinshu/Chinese Journal of Rare Metals | 2020年 / 44卷 / 02期
关键词：
CALPHAD; Lead-free solder; Sn-Bi-In; Thermodynamic calculation;
D O I：
10.13373/j.cnki.cjrm.XY18110031
中图分类号：
学科分类号：
摘要：
The traditional soldering material of Sn-Pb is mainly used in the field of electronic packaging due to its good wettability and excellent performance. Lead poison is not in line with the concept of green development, reducing the use of lead can protect the environment and human health. So new lead-free solders must be developed to replace traditional Sn-Pb solders. The new low-temperature solder includes Sn-Bi and Sn-In alloys. The paper summarized the advantages and disadvantages of Sn-Pb solders, and elaborated the performance of Sn-Bi and Sn-In low-temperature lead-free solders compared with Sn-Pb solder. The effects of interaction between In and Bi on microstructure and properties of Sn-based lead-free solders were analyzed. The low-temperature Sn-Bi-In alloy was green and non-polluting and would be a new lead-free solder alloy that could be used in consumer electronics. The phase diagram calculation could be used to screen the better alloy composition, which provided a reference for the further study of Sn-Bi-In lead-free solder. Therefore, the phase diagram calculation of the Sn-Bi-In ternary system was particularly important. The current research and thermodynamic model of phase diagram calculation of Sn-Bi-In alloys were discussed. The phase structure parameters and thermodynamic data of some Sn-Bi-In ternary alloys were collected. Meanwhile, CALPHAD was combined to illustrate the advantages of applying phase diagram calculation to the development of new Sn-Bi-In solders. © Editorial Office of Chinese Journal of Rare Metals. All right reserved.
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页码：195 / 204
页数：9
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