High temperature reliability of high-power LED module using die attach material of nano-silver paste

被引：0
|
作者：
Chen J. [1 ]
Li X. [1 ]
Kong Y.-F. [1 ]
Mei Y.-H. [1 ]
Lu G.-Q. [1 ,2 ]
机构：
[1] School of Material Science and Engineering, Tianjin University, Tianjin
[2] Department of Material Science and Engineering, Virginia Tech, Montgomery
来源：
Faguang Xuebao/Chinese Journal of Luminescence | 2016年 / 37卷 / 09期
关键词：
Accelerated degradation testing; Die attach materials; High power LED module; Lifetime; Nano-silver paste;
D O I：
10.3788/fgxb20163709.1159
中图分类号：
学科分类号：
摘要：
A general procedure for accelerated degradation testing (ADT) was presented to predict the lifetime of three kinds of LED modules. The die attach materials of LED modules were nano-silver paste, Sn3Ag0.5Cu (Sn-based alloys), silver epoxy, respectively. The ambient temperature and forward current were controlled, and the light output at several time points was measured. The degradation mechanism of LEDs modules was analyzed. The lifetimes of LED modules under the condition of different die attach materials were predicted. The test results show that the nano-silver paste is a very promising die-attach material for the aging of multi-chip high power LED modules. © 2016, Science Press. All right reserved.
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页码：1159 / 1165
页数：6
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