Bump height measurement of chip packaging based on white light triangulation

被引：0
|
作者：
Lin X. [1 ]
Wu Z. [1 ]
Ye R. [1 ]
Wang L. [1 ]
机构：
[1] School of Aerospace Engineering, Xiamen University, Xiamen
来源：
Guangxue Jingmi Gongcheng/Optics and Precision Engineering | 2023年 / 31卷 / 13期
关键词：
bump measurement; chip detection; deep learning; light stripe center;
D O I：
10.37188/OPE.20233113.1890
中图分类号：
学科分类号：
摘要：
To measure the bump height of chip packaging，a measurement system based on white-light tri⁃ angulation was established，and a method for measuring the bump height in a complex background was pro⁃ posed. First，the bump-height measurement system was built according to the proposed measurement model. Next，the U-Net deep learning model was used to segment the light stripe image，and the gray⁃ scale barycenter method and interpolation method were combined for extracting the complete light stripe center to overcome the interference of the complex background. Subsequently，the measurement system was calibrated to determine the corresponding relationship between the pixel value and the actual height value. Finally，the height of the bump was determined via function fitting. The experimental results indi⁃ cate that the average repeatability of bump-height measurement is 0. 21 μm，with a standard deviation of 0. 095 μm；the average measurement error is -0. 04 μm，with a standard deviation is 0. 408 μm. In this study，bump-height measurement with high accuracy and robustness in a complex background was real⁃ ized，which can satisfy the requirements of online detection of wafer bump coplanarity in chip packaging. © 2023 Chinese Academy of Sciences. All rights reserved.
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页码：1890 / 1899
页数：9
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