Integrated Rogowski Coil Sensor for Press-pack Insulated Gate Bipolar Transistor Chips With Shielding Layers

被引:0
|
作者
Jiao C. [1 ]
Huang T. [2 ]
Zhang X. [1 ]
Dai A. [3 ]
机构
[1] School of Electrical Engineering, Beijing Jiaotong University, Haidian District, Beijing
[2] Smart Grid Jining Electrical Power Company, Shandong Province, Jining
[3] State Key Laboratory of Advanced Power Transmission Technology, Global Energy Interconnection Research Institute Co., Ltd., Changping District, Beijing
关键词
chip current measurement; PCB Rogowski coils; press-pack IGBT; shielding layer;
D O I
10.13334/j.0258-8013.pcsee.213037
中图分类号
学科分类号
摘要
HVDC flexible transmission is an important way to build global energy interconnection, in which Press-Pack IGBT is a key device of the converter valve system. Due to the small area and low current capacity of a single Press-Pack IGBT IGBT chip, multiple IGBT chips need to be connected in parallel in order to improve the transmission capacity of HVDC Flexible. However, because of the difference of electrical parameters of parallel chips, IGBT chips have uneven current and current overshoot in the switching process. Based on Lumped parameter model of Rogowski coil, this paper analyzed the influence of the electric field formed by the fast change of emitter and collector voltage of the IGBT on the measurement error of PCB Rogowski coil in the process of IGBT testing, put forward a method to eliminate the electric field interference with metal shielding layer, and verified the effectiveness of this method. Then, through simulation and test, the self-inductance and the distributed capacitance (including capacitance between the shielding layers and coils) of the Rogowski coil, and the adverse effect on the measurement frequency band caused by the introduction of shielding layer were firstly analyzed through equivalent circuit theory model and experiment. Finally, an integrated PCB Rogowski coil current sensor with metal shielding layer was designed to detect the current of parallel chips in specific crimped IGBT devices in real time. © 2022 Chinese Society for Electrical Engineering. All rights reserved.
引用
收藏
页码:9105 / 9117
页数:12
相关论文
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