Study on Surface Material Removal Uniformity in Double Side Grinding Based on Abrasive Particle Trajectories

被引：1
|
作者：
Li Q.-L. [1 ]
Xiu S.-C. [1 ]
Zhang P. [1 ]
Wang K. [2 ]
机构：
[1] School of Mechanical Engineering & Automation, Northeastern University, Shenyang
[2] Shenyang Hermos CNC Machine Co., Ltd., Shenyang
来源：
Dongbei Daxue Xuebao/Journal of Northeastern University | 2020年 / 41卷 / 12期
关键词：
Abrasive particle trajectory; Double side grinding; Material removal; Surface quality; Uniformity;
D O I：
10.12068/j.issn.1005-3026.2020.12.009
中图分类号：
学科分类号：
摘要：
In the double side grinding process, the two surfaces of the workpiece were ground separately by two end grinding wheels, which has a high processing efficiency. However, the removal non-uniformity of surface materials still exists. Material removal distribution model was established and the simulation and experimental researches were carried out under different grinding parameters in order to analyze the factors affecting the removal non-uniformity of surface materials in the double side grinding. The research demonstrated that the speed ratio of the grinding wheel and the workpiece has a significant effect on the removal uniformity of surface materials. The simulation data was consistent with the experimental results, which provides a theoretical basis for improving the removal uniformity of surface materials and surface quality. © 2020, Editorial Department of Journal of Northeastern University. All right reserved.
引用
收藏
页码：1727 / 1732
页数：5
相关论文
共 20 条
  • [1] Zhang D K, Li C H, Jia D Z, Et al., Grinding model and material removal mechanism of medical nanometer zirconia ceramics, Recent Pat Nanotech, 8, 1, pp. 2-17, (2014)
  • [2] Lu Han-min, Wen Jia-wang, Xiu Shi-chao, Et al., Analysis of multi-scale point grinding surface texture features and tribological properties, Machinery Design & Manufacture, 7, pp. 93-95, (2016)
  • [3] Wang Sheng, Zhang Qiang, Li Chang-he, Finite element modeling approaches in grinding, Precise Manufacturing & Automation, 1, pp. 40-45, (2013)
  • [4] Hocheng H, Tsai H Y, Tsai M S., Effects of kinematic variables on nonuniformity in chemical mechanical planarization, International Journal of Machine Tools Manufacture, 40, 11, pp. 1651-1669, (2000)
  • [5] Kasai T., A kinematic analysis of disk motion in a double sided polisher for chemical mechanical planarization (CMP), Tribology International, 41, 2, pp. 111-118, (2008)
  • [6] Kim H, Jeong H., Effect of process conditions on uniformity of velocity and wear distance of pad and wafer during chemical mechanical planarization, Journal of Electronic Materials, 33, 1, pp. 53-60, (2004)
  • [7] Hu Z W, Fang C F, Deng W W, Et al., Speed ratio optimization for ceramic lapping with fixed diamond pellets, International Journal of Advanced Manufacturing Technology, 90, pp. 3159-3169, (2017)
  • [8] Tam H Y, Cheng H., An investigation of the effects of the tool path on the removal of material in polishing, Journal of Materials Processing Technology, 210, 5, pp. 807-818, (2010)
  • [9] Tso P L, Wang Y Y, Tsai M J., A study of carrier motion on a dual-face CMP machine, Journal of Materials Processing Technology, 116, 2, pp. 194-200, (2001)
  • [10] Baisie E A, Li Z C, Zhang X H., Design optimization of diamond disk pad conditioners, International Journal of Advanced Manufacturing Technology, 66, pp. 2041-2052, (2013)
12