Influence of Abrasive Array Pattern on Cutting Performance of Diamond Saw Blades

被引:0
|
作者
Liu Z. [1 ]
Yin Y. [1 ,2 ]
Jing C. [1 ]
Wu M. [1 ]
Tao H. [2 ]
Cheng Y. [2 ]
机构
[1] College of Materials Science and Engineering, Xi'an University of Architecture and Technology, Xi'an
[2] Monte⁃Bianco Co., Ltd., Guangdong, Foshan
来源
Cailiao Daobao/Materials Reports | 2023年 / 37卷 / 08期
关键词
diamond saw blade; metal bond; orderly array; service life; sharpness;
D O I
10.11896/cldb.21070268
中图分类号
学科分类号
摘要
In this work, the method of multi⁃layer orderly array was used to prepare Fe⁃, Co⁃ and Cu⁃based matrix diamond saw blades with orderly⁃ distributed abrasive grains. The cutting performance of diamond saw blades with random and orderly⁃distributed abrasive grains was compared. Cutting current represented the sharpness of diamond saw blades, and loss of saw blade outer diameter represented the service life. The result showed that the diamond saw blades with orderly⁃distributed abrasive grains have better sharpness, service life and cutting stability. The maximum cutting current of Fe⁃based matrix diamond saw blade with orderly⁃distributed abrasive grains is 4.09 A, and the loss of the saw blade outer diameter of Fe⁃based is 0.45 mm after cutting 96 m ceramic tile, presenting similar performance to the same type of Co⁃based saw blade. © 2023 Cailiao Daobaoshe/ Materials Review. All rights reserved.
引用
下载
收藏
相关论文
共 26 条
  • [1] Xie D L, Wan L, Song D, Et al., Materials & Design, 87, (2015)
  • [2] Wang L, Guo S, Gao J, Et al., Journal of Alloys and Compounds, 727, (2017)
  • [3] Zhang W Z, Yang H., Diamond & Abrasives Engineering, 37, 3, (2017)
  • [4] Jiang R C., Stone, 10
  • [5] Yin S H, Chen F J, Yu J W, Et al., Advanced Materials Research, 497, (2012)
  • [6] Zhang S H, Yang X, Xie X H, Et al., Powder Metallurgy Technology, 26, 6, (2008)
  • [7] Wang J, Zhang F L, Niu L, Et al., Powder Metallurgy Technology, 36, 2, (2018)
  • [8] Xu L, Liu Y B, Luo X L, Et al., Materials Science Forum, 972, (2019)
  • [9] Huang G Q, Xu X P., Solid State Phenomena, 175, (2011)
  • [10] Lyu H W, Ma T, Liu Z J, Et al., Diamond & Abrasives Engineering, 158, 2, (2007)