Thermal contact conductance between sliding rough surfaces

被引：0
|
作者：
Liu Y. [1 ]
Ye F. [2 ]
Li H. [3 ]
Wu J. [4 ]
Sun N. [1 ]
机构：
[1] School of Mechanical Electronic & Information Engineering, China University of Mining and Technology, Beijing
[2] Huawei Machine Co., Ltd., Dongguan
[3] College of Urban Transportation and Logistics, Shenzhen Technology University, Shenzhen
[4] School of Mechanical Engineering, Beijing Institute of Technology, Beijing
来源：
Zhendong yu Chongji/Journal of Vibration and Shock | 2019年 / 38卷 / 22期
关键词：
Heat conduction; Peclet number; Rough surface; Sliding contact; Thermal contact conductance(TCC);
D O I：
10.13465/j.cnki.jvs.2019.22.025
中图分类号：
学科分类号：
摘要：
Thermal contact conductance between contacting rough surfaces plays a significant role for the operational reliability and working life of machines. The effective thermal contact conductance between two rough sliding surfaces was analyzed and predicted, and a general equation applicable for the whole range of Peclet numbers was provided. The results reveal that at large Peclet number, the effective thermal conductance is not only dependent on the contact pressure, the thermo-physical properties of material and the surface roughness parameters, but also proportional to the square root of the sliding velocity. In addition, at low Peclet number, the thermal contact conductance and the contact pressure are approximately in a linear relation when the material properties and the asperity summit radii are given. These results provide guidances for the design of contact heat exchange. © 2019, Editorial Office of Journal of Vibration and Shock. All right reserved.
引用
收藏
页码：178 / 183
页数：5
相关论文
共 30 条
  • [1] Li X., Liu Y., Wang X., Et al., Modeling of 3D fractal thermal contact conductance and multi-parameter effect analyses, Journal of Vibration and Shock, 37, 5, pp. 1-6, (2018)
  • [2] Madhusudana C.V., Thermal Contact Conductance, (1996)
  • [3] Gu W., Experiment on thermal contact resistance, Journal of Nanjing Aeronautical Institute, 24, 1, pp. 46-53, (1992)
  • [4] Xu L., Yang J., Xu J., Et al., The research of contact thermal resistance of solid surface at low temperature, Cryogenics and Superconductivity, 1, pp. 53-58, (1996)
  • [5] Zhan L., Li X., Hu S., Experiment research for the interfacial thermal contact resistance, Light Alloy Fabrication Technology, 30, 9, pp. 40-43, (2002)
  • [6] Cooper M.G., Mikic B.B., Yovanovich M.M., Thermal contact conductance, International Journal of Heat and Mass Transfer, 12, 69, pp. 279-300, (1969)
  • [7] Whitehouse D.J., Archard J.F., The properties of random surfaces of significance in their contact, Proceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences, 316, 1524, pp. 97-121, (1970)
  • [8] Mikic B., Thermal contact conductance
  • [9] theoretical considerations, International Journal of Heat and Mass Transfer, 17, 2, pp. 205-214, (1974)
  • [10] Yovanovich M.M., Tien C.H., Schneider G.E., General solution of constriction resistance within a compound disk, AIAA Paper, 79, (1979)
123