Message from the chairs of techdebt 2019

被引：0
|
作者：
Ozkaya, Ipek [1 ]
机构：
[1] Software Engineering Institute, Pittsburgh, United States
来源：
Proceedings - 2019 IEEE/ACM International Conference on Technical Debt, TechDebt 2019 | 2019年
关键词：
D O I：
10.1109/TechDebt.2019.00006
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学科分类号：
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