Effect of fluorine-containing groups on the corona resistance and dielectric properties of polyimide

被引:0
|
作者
Zhao W. [1 ]
Song J. [1 ]
Chen H. [1 ]
Lin X. [1 ]
Huang Z. [1 ]
Zhou Y. [1 ]
Weng L. [1 ]
机构
[1] School of Materials Science and Chemical Engineering, Harbin University of Science and Technology, Harbin
关键词
block copolymer; corona resistance; dielectric properties; fluorinated polyimide; insulating materials; three-layer;
D O I
10.13801/j.cnki.fhclxb.20230908.002
中图分类号
学科分类号
摘要
The increasing use of electrical equipment at high frequencies poses greater demands on the corona aging resistance and dielectric properties of insulating materials. Therefore, it is crucial to enhance the insulation properties of insulating materials for the development of high-frequency power systems. In this study, we utilized 2, 2'-bis(trifluoromethyl)-4, 4'-diaminodiphenyl ether (6FODA), 4, 4'-diaminodiphenyl ether (ODA), and 1, 2, 4, 5-benzenetetracarboxylic anhydride (PMDA) as reactive monomers to design and synthesize block copolymerized fluoro-polyimide (FPI) three-layer films. The focus was primarily on assessing the corona-resistant and dielectric properties of these materials. Results reveal that the corona-resistant life of the block copolymerized FPI three-layer films, with varying amounts of fluorine, is higher when compared to the pure polyimide (PI) three-layer films. Furthermore, the corona-resistant life of the films increase with an increase in fluorine content. When the molar ratio of ODA to 6FODA is 1∶9, the corona resistance life of the three-layer film can reach up to 4.0 h at room temperature (20℃) and 80 kV/mm, which is 2.86 times higher than that of the pure PI three-layer film (1.4 h). Moreover, with the increase of fluorine content, the dielectric constant of FPI three-layer film shows a trend of decreasing and then increasing, and the dielectric constant of the three-layer film when the molar ratio of ODA and 6FODA is 1∶1 can be reduced to as low as 2.26 at 1 MHz, and the dielectric loss and conductivity show a trend of increasing and then decreasing. The dielectric strength decreases with the increase of fluorine content, but they are all higher than that of the pure PI three-layer film, and the dielectric strength of the three-layer film is as high as 434 kV/mm when the molar ratio of ODA to 6FODA is 9∶1. © 2024 Beijing University of Aeronautics and Astronautics (BUAA). All rights reserved.
引用
收藏
页码:2425 / 2435
页数:10
相关论文
共 29 条
  • [1] WAN B Q, DONG X D, YANG X, Et al., High strength, stable and self-healing copolyimide for defects induced by mechanical and electrical damages, Journal of Materials Chemistry C, 10, 31, pp. 11307-11315, (2022)
  • [2] WAN Baoquan, ZHENG Mingsheng, ZHA Junwei, Progress of polyimide-based composite dielectrics for energy storage applications, Insulating Materials, 54, 11, pp. 23-33, (2021)
  • [3] WANG Xiangwen, FAN Yong, CHEN Hao, Et al., Dielectric and thermal properties of nano Mg(OH)<sub>2</sub>-ZnO/polyimide composite film, Acta Materiae Compositae Sinica, 35, 1, pp. 30-34, (2018)
  • [4] ZHAO W, FAN Y, CHEN H., Dielectric properties and corona resistance of Si-B/epoxy nano-composites, Journal of Materials Science: Materials in Electronics, 30, 17, pp. 16298-16307, (2019)
  • [5] YANG Ruixiao, CHEN Hao, WANG Xiangwen, Et al., Preparation and properties of five layer nano SiO<sub>2</sub>-Al<sub>2</sub>O<sub>3</sub>/polyimide composite film, Acta Materiae Compositae Sinica, 35, 5, pp. 1050-1058, (2018)
  • [6] ANGALANE S K, KASINATHAN E., A review on polymeric insulation for high-voltage application under various stress conditions, Polymer Composites, 43, 8, pp. 4803-4834, (2022)
  • [7] WU X, CAI J, CHENG Y., Synthesis and characterization of high fluorine-containing polyimides with low-dielectric constant, Journal of Applied Polymer Science, 139, 16, (2022)
  • [8] PENG W, LEI H, QIU L, Et al., Perfiuorocyclobutyl-containing transparent polyimides with low dielectric constant and low dielectric loss, Polymer Chemistry, 13, 26, pp. 3949-3955, (2022)
  • [9] XIAO P, HE X, ZHENG F, Et al., Superheat resistant, transparent and low dielectric polyimides based on spirocyclic bisbenzoxazole diamines with T<sub>g</sub>>450℃, Polymer Chemistry, 13, 24, pp. 3660-3669, (2022)
  • [10] Recommended test methods for determining the relative resistance of insulating materials to breakdown by surface discharges: GB/T 22689− 2008, (2008)