Research on the RF performance simulation of ultra-fine wire bonding of RF devices

被引:0
|
作者
Wang S. [1 ]
Ma J. [1 ]
Yang D. [1 ,2 ]
Xu J. [1 ]
Hang C. [1 ]
Tian Y. [1 ]
机构
[1] State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin
[2] Guobo Electronics Co., Ltd., Nanjing
关键词
Impedance matching; RF performance; Ultra-fine wire bonding;
D O I
10.12073/j.hjxb.20201125001
中图分类号
学科分类号
摘要
With the continuous improvement of radar performance indicators and the continuous compression of the volume, the T/R (transmitter and receiver) component as one of its key components is also continuously developing in the direction of miniaturization and high density. Ultra-high-density wire bonding technology is adopted to realize high-density RF device packaging form. However, it will cause the reliability of bonding solder joints to decrease, and the circuit RF performance is poor. Aiming at the problem of the degradation of radio frequency performance caused by the small bond size, this paper used HFSS software to explore the influence of the change in the gold strip's size on the circuit radio frequency performance. And ANSYS Q3D and ADS software were used to match the impedance of the ultra-fine wire bonding circuit. The results show that for gold wire and gold ribbon, inserting the microstrip double-stub matching structure can significantly improve the radio frequency performance of the circuit. For type 1 structure, the transmission power of S21 and S12 can reach −0.049 dB. For type 2 Structure, the transmission power of S21 and S12 can reach −7.245 × 10 −5 dB, indicating that the signal transmission under the type 2 structure is almost lossless. This result can lay a theoretical foundation for the application of ultra-fine wire bonding technology in radio frequency circuits. © 2021, Editorial Board of Transactions of the China Welding Institution, Magazine Agency Welding. All right reserved.
引用
收藏
页码:1 / 7
页数:6
相关论文
共 14 条
  • [1] Shao Chunsheng, Study status and development trend of phased array radar, Modern Radar, 38, 6, pp. 1-4, (2016)
  • [2] Ortiz J A, Diaz J, Abosewal N, Et al., Ultra-compact universal polarization X-band unit cell for high-performance active phased array radar, 2016 IEEE International Symposium on Phased Array Systems and Technology (PAST), pp. 1-5, (2016)
  • [3] Kim K, Kim H, Kim D, Et al., Development of planar active phased array antenna for detecting and tracking radar, 2018 IEEE Radar Conference, pp. 0100-0103, (2018)
  • [4] Kumar P, Kedar A, Singh A K., Subarray scheme for wide scan active phased array antennas, 2014 IEEE International Microwave and RF Conference, pp. 364-367, (2014)
  • [5] Tan Cheng, Yu Zhongjun, Zhu Zhiqiang, Et al., Design of Ku-band four-channel T/R module based on LTCC technology, Electronic Components and Materials, 39, 4, pp. 62-67, (2020)
  • [6] Waldrop M M., The chips are down for Moore's law, Nature, 530, 7589, pp. 144-147, (2016)
  • [7] Sun Lei, Zhang Yi, Chen Minghe, Et al., Finite element analysis of solder joint reliability of 3D packaging chip, Transactions of the China Welding Institution, 42, 1, pp. 49-53, (2021)
  • [8] Yang Yuqiang, Li Zhnagzhi, Li Deyu, Et al., Research on fatigue life of bellows containing volumetric defects based on ANSYS, Pressure Vessel Technology, 37, 11, pp. 33-38, (2020)
  • [9] Sun Qingjie, Sang Haibo, Liu Yibo, Et al., Cross section scan trace planning based on arc additive manufacturing, China Welding, 28, 4, pp. 16-21, (2019)
  • [10] Zou Jun, Research of microwave characteristics and consistency of bonding interconnects in T/R module, (2009)