Preparation and Characterization of Bismaleimide Foam Adhesive

被引:0
|
作者
Zhao D. [1 ]
Li G. [1 ]
Song J. [1 ]
Chen W. [1 ]
Cui B. [1 ]
机构
[1] Institute of Petrochemistry Heilongjiang Academy of Science, Harbin
关键词
Bismaleimide; Cyanate; Dielectric constant; Foam adhesive; High temperature resistance;
D O I
10.16865/j.cnki.1000-7555.2022.0079
中图分类号
学科分类号
摘要
A high temperature resistant bismaleimide/cyanate foam adhesive was synthesized with 4, 4' - bismaleimide diphenylmethane (BMI-1), bisphenol A dicyanate (BADCy), phenolphthalein polyaryl ether sulfone (PES-C) and blowing agent. The cure reaction of the resin was investigated by differential scanning calorimetry (DSC), in situ FT-IR. SEM analysis suggest the foam evenly with fine cells, the average cell diameter is 0.275 mm. Thermogravimetric analyzer (TGA) suggests that the foam adhesive has a higher temperature resistance, Td10 in air and nitrogen atmosphere is 393℃ and 412℃, respectively. At 9.375 GHz, the dielectric constant of foam is 1.65, tan δ is 0.0057, showing excellent dielectric properties. Pipe shear test shows that it has excellent bonding performance and the temperature resistance -55℃, 25℃ and 150 ℃ pipe shear strength is not less 7 MPa, 205℃ pipe shear strength is greater than 4 MPa. Tensile test of the foam adhesive with a variety of materials shows that it has excellent bonding properties to a variety of materials, aluminum- aluminum tensile strength is 9.2 MPa, titanium-titanium tensile strength is 5.9 MPa, bismaleimide composite material- bismaleimide composite material strength is 5.9 MPa. © 2022, Editorial Board of Polymer Materials Science & Engineering. All right reserved.
引用
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页码:126 / 133
页数:7
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