Detection and Classification of Printed Circuit Board Assembly Defects Based on Deep Learning

被引：0
|
作者：
Ye, Ruifang [1 ]
Pan, Chia-Sheng [2 ]
Hung, Pei-Yuan [2 ]
Chang, Ming [2 ]
Chen, Kuan-Yu [2 ]
机构：
[1] College of Mechanical Engineering and Automation, Huaqiao University, Xiamen,361021, China
[2] Department of Mechanical Engineering, Chung Yuan Christian University, Chungli,32023, Taiwan
来源：
Journal of the Chinese Society of Mechanical Engineers, Transactions of the Chinese Institute of Engineers, Series C/Chung-Kuo Chi Hsueh Kung Ch'eng Hsuebo Pao | 2020年 / 41卷 / 04期
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页码：401 / 407
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