Electric-thermal-stress Oriented Multi-objective Optimal Design of Power Module Package

被引：0
|
作者：
Zeng Z. [1 ]
Li X. [1 ]
Lin C. [1 ]
Ran L. [1 ]
机构：
[1] State Key Laboratory of Power Transmission Equipment & System Security and New Technology, Chongqing University, Shapingba District, Chongqing
来源：
Zhongguo Dianji Gongcheng Xuebao/Proceedings of the Chinese Society of Electrical Engineering | 2019年 / 39卷 / 17期
基金：
中国国家自然科学基金; 国家重点研发计划;
关键词：
Electric-thermal-stress multi-physics; Multi-objective optimum; Multi-physic field modeling; Package design; Power module;
D O I：
10.13334/j.0258-8013.pcsee.180965
中图分类号：
学科分类号：
摘要：
Due to the common applications of power modules and increasing penetration of wide bandgap devices, low parasitic, low thermal-resistance, and high reliability packaging for power modules is urgently needed. Focusing on the coupling principles among electric-thermal-stress multi-physics in power modules, characteristics of parasitic, thermal-resistance, power-cycling and thermal-cycling based life-times are modeled and quantified. To achieve an advanced power package, the trade-off among parasitic inductance, thermal resistance, and reliability were revealed, then a multi-objective optimal model was proposed to balance the electric-thermal-stress trade-off. Non-dominated sorting genetic algorithm (NSGA-II) was employed to obtain the Pareto-based optimal solutions. According to the multi-objective model, the effect principles of solders, ceramics, and baseplates by using different materials were comprehensively compared. Additionally, the specifications of packaging materials in each layer were represented. The proposed theories and approaches are of reference value for the optimal design of power module package. © 2019 Chin. Soc. for Elec. Eng.
引用
收藏
页码：5161 / 5171
页数：10
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