Module development for the ATLAS ITk Pixel detector

The High Luminosity Large Hadron Collider (HL-LHC) will achieve unparallelled instantaneous luminosity, leading to approximately 200 proton-proton interactions during a bunch crossing. The existing ATLAS Inner Detector will be replaced by an entirely silicon-based system known as the Inner Tracker (ITk). The ITk's innermost section will incorporate a cutting-edge pixel detector with diverse silicon sensor technologies being used across the five barrel and end-cap layers. As initial modules have been assembled with the prototype ITkPix readout chip, a variety of aspects are under investigation. These range from production-related ones such as bump bonding, to assembly methods of dedicated wire-bond mechanical protection and layout-related aspects such as the distribution of data links amongst several chips and modules. This article presents results of several such studies, directly affecting the module production for the ATLAS ITk Pixel detector.