Interfacial Strain Analysis of Bending Bilayer Silicone Elastomer Films Using a Cholesteric Liquid Crystal Sensor

被引:0
|
作者
Kishino, Masayuki [1 ,2 ]
Akamatsu, Norihisa [1 ]
Taguchi, Ryo [1 ,2 ]
Hisano, Kyohei [1 ,2 ]
Tsutsumi, Osamu [3 ]
Shishido, Atsushi [1 ,2 ,4 ]
机构
[1] Tokyo Inst Technol, Lab Chem & Life Sci, Inst Innovat Res, Yokohama 2268503, Japan
[2] Tokyo Inst Technol, Dept Chem Sci & Engn, Tokyo 1528552, Japan
[3] Ritsumeikan Univ, Dept Appl Chem, Kusatsu 5258577, Japan
[4] Tokyo Inst Technol, Living Syst Mat LiSM Res Grp, Int Res Frontiers Initiat IRFI, Yokohama 2268501, Japan
来源
ACS APPLIED ENGINEERING MATERIALS | 2023年 / 1卷 / 06期
关键词
interfacial strain; bending; silicone elastomer; bilayer film; cholesteric liquid crystal; RECENT PROGRESS; SHEET;
D O I
10.1021/acsaenm.3c00170
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The analysis of the bending strain at the interface of layered polymer films is significant in the design of flexible electronic devices because conductive materials placed on the interface are degraded by strain. Although theoretical calculations and numerical simulations of the interfacial bending strain of polymer films have been conducted, few experimental analyses have been reported because of the difficulty in measuring the interface strain. In our previous study, the internal strain in a bending polymer film was successfully measured using a cholesteric liquid crystal elastomer (CLCE) sensor. Herein, we report the interfacial strain analysis of a bending bilayer film composed of poly(dimethylsiloxane) (PDMS) films with different Young's moduli using a CLCE sensor. The experimental strain analysis revealed that the bending strain at the interface depends on the distance between the interface and the neutral mechanical plane (NMP), which experiences no strain. Notably, as the bilayer films bend significantly, the NMP shifts toward the inner bending surface because of the change in the balance between the tensile and compressive stresses in the film. This study enables us to understand the interface bending strain in polymer films, which will aid in the design of flexible electronic devices with conductive materials placed on the interface whose strain is minimized.
引用
收藏
页码:1669 / 1675
页数:7
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