Gradient microstructures and mechanical properties of WAAMed and aged Al-Cu alloy after laser shock peening

The integration of wire-arc additive manufacture (WAAM) and laser shock peening (LSP) facilitated the study of the gradient microstructure in T6-treated WAAM Al-Cu alloy and the synergistic strengthening mechanisms involving the precipitation phase and LSP parameters. The results indicate that pore closures, increases in kernel average misorientation (KAM), and low angle grain boundary (LAGB) are positively associated with LSP energy density. Residual stress positively correlates with LSP energy density and inversely with spot diameter, where larger spots exacerbate non-uniformity. The values of dislocation density, microhardness and residual stress of the post-LSP specimen gradually increase with the increase of depth, and reach the maximum value at similar to 100 mu m. As the depth continues to increase, the value begins to decrease gradually. Dislocation accumulation near grain boundaries, interacting with theta'-Al2Cu, contributes to strength enhancement. The main strengthening mechanisms enhanced by LSP involve creating a gradient microstructure through significant plastic deformation, pore closure, and the presence of high-density dislocations. Post-T6 treatment, theta'-Al2Cu significantly restricts dislocation slip, pins dislocations, and encourages the emergence of new dislocation sources, thereby enhancing the strengthening effect and stability induced by LSP.