Application of the thermoelectric cooling system in making a cooling belt: A case of heat stress control measure device

被引:0
|
作者
Samani, Ali Sahraneshin [1 ,2 ]
Ghavamabadi, Leila Ibrahimi [3 ]
Dehaghi, Behzad Fouladi [1 ,2 ]
机构
[1] Ahvaz Jundishapur Univ Med Sci, Med Basic Sci Res Inst, Environm Technol Res Ctr, Ahvaz, Iran
[2] Ahvaz Jundishapur Univ Med Sci, Sch Hlth, Dept Occupat Hlth, Ahvaz, Iran
[3] Islamic Azad Univ, Dept Environm Management HSE, Ahvaz, Iran
关键词
Cooling belt; air temperature; thermoelectric; heat stress; control; RESPONSES; CAPACITY; VEST;
D O I
10.3233/WOR-230329
中图分类号
R1 [预防医学、卫生学];
学科分类号
1004 ; 120402 ;
摘要
BACKGROUND: Climate change and global warming are emerging as new challenges worldwide. The World Meteorological Organization has reported that the temperature is expected to rise by an average of 1.2 degrees C between 2021-2025. This increase in temperature will expose more and more workers to extreme heat. OBJECTIVE: This study aimed to explore the possibility of using thermoelectric coolers for cooling the water circulation circuit of a cooling belt, which can be used for extended periods in high-temperature environments. METHODS: A cooling belt was designed using thermoelectric coolers (TEC) and two blowers. The TECs were equipped with heat sinks and heat exchange block made of aluminum at hot and cold sides to exchange heat effectively. RESULTS: The experiment was conducted under actual environmental temperature conditions during three different time periods, with mean temperatures of 31, 48, and 41 degrees C. The mean temperature of the belt section was recorded as 20.73, 24.52, and 21.38 degrees C, respectively. The maximum average difference between the inlet air temperature and the inside cooling belt temperature was 40.45 degrees C. CONCLUSION: The experiment revealed that the cooling performance of the designed prototype remained within an acceptable range (18 degrees C) despite the increase in ambient temperature. Moreover, the cooling system can be utilized in high-heat environments to reduce thermal stress.
引用
收藏
页码:797 / 805
页数:9
相关论文
共 50 条
  • [1] Heat sink design for a thermoelectric cooling system
    Han, Hun Sik
    Kim, Seo Young
    Ji, Tae Ho
    Jee, Young-Jun
    Lee, Daewoong
    Jang, Kil Sang
    Oh, Dong Hoon
    2008 11TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, VOLS 1-3, 2008, : 1222 - +
  • [2] Application of genetic algorithm to maximizing the cooling capacity in a thermoelectric cooling system
    Cheng, Yi-Hsiang
    Shih, Chunkuan
    2005 IEEE International Conference on Industrial Technology - (ICIT), Vols 1 and 2, 2005, : 336 - 339
  • [3] MODELING AND CONTROL OF A NOVEL THERMOELECTRIC COOLING SYSTEM
    Bardarson, Jeremy
    Clement, Jack
    Dahiya, Sachin
    Gartia, Manas Ranjan
    Barbalata, Corina
    PROCEEDINGS OF ASME 2022 INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, IMECE2022, VOL 4, 2022,
  • [4] Heat Sink Design of Thermoelectric Module for Cooling System
    Monel, Muhamad Arshad Mohd
    Kamal, Mahanijah Md
    Omar, Muhamad Hishamuddin
    2016 6TH IEEE INTERNATIONAL CONFERENCE ON CONTROL SYSTEM, COMPUTING AND ENGINEERING (ICCSCE), 2016, : 184 - 188
  • [5] Calculation and optimization of heat exchangers for a thermoelectric cooling system
    E. N. Vasil’ev
    Thermophysics and Aeromechanics, 2022, 29 : 401 - 410
  • [6] Experimental investigation of thermoelectric cooling system with heat recovery
    Golebiowska, Justyna
    Zelazna, Agnieszka
    11TH CONFERENCE ON INTERDISCIPLINARY PROBLEMS IN ENVIRONMENTAL PROTECTION AND ENGINEERING (EKO-DOK 2019), 2019, 100
  • [7] Calculation and optimization of heat exchangers for a thermoelectric cooling system
    Vasil'ev, E. N.
    THERMOPHYSICS AND AEROMECHANICS, 2022, 29 (03) : 401 - 410
  • [8] Thermoelectric Cooling Device Integrated with PCM Heat Storage for MS Patients
    Li, X.
    Mahmoud, S.
    Al-Dadah, R. K.
    Elsayed, A.
    INTERNATIONAL CONFERENCE ON APPLIED ENERGY, ICAE2014, 2014, 61 : 2399 - 2402
  • [9] Downhole Electronics Cooling Using a Thermoelectric Device and Heat Exchanger Arrangement
    Sinha, Ashish
    Joshi, Yogendra K.
    JOURNAL OF ELECTRONIC PACKAGING, 2011, 133 (04)
  • [10] Analysis and Characterization of Thermoelectric Module and Heat Exchanger Performance in a Hybrid System Cooling Application
    Campbell, L. A.
    Wagner, R.
    Simons, R. E.
    2011 27TH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM (SEMI-THERM), 2011, : 48 - 53