Electrical Properties' Stability of Flexible Carbon-Based Conductive Layers

This paper deals with the electrical properties' stability of flexible carbon-based conductive layers by applying the bending tests (1 million cycles for every sample). The first part of experiments delves into the design, fabrication, and characterization of carbon-based conductive layers, exploring the influence of various shapes of conductive tracks. The second part of experiments are focused on detailed investigation of conductive joints realization between the SMD components (0R resistors with 0805 packages) by analyzing different layouts and three materials for the joint's creation. For this reason, the carbon-based conductive glue, silver-filled epoxy conductive glue and low-temperature solder paste were used and analyzed. The final paper systematically evaluates the stability of electrical properties, including conductivity and resistance, under different mechanical deformations and stressors by applying the axial and radial bending tests. The stability of electrical properties demonstrated in this paper paves the way for the development of more resilient and durable electronic carbon-based structures, offering new possibilities for the integration of flexible electronics into everyday devices and emerging technologies.