Liquid Metal Oxide-Assisted Integration of High-k Dielectrics and Metal Contacts for Two-Dimensional Electronics

被引:1
|
作者
Venkatakrishnarao, Dasari [1 ,2 ]
Mishra, Abhishek [1 ,3 ]
Tarn, Yaoju [1 ]
Bosman, Michel [1 ,4 ]
Lee, Rainer [1 ,3 ]
Das, Sarthak [1 ,3 ]
Mukherjee, Subhrajit [1 ,3 ]
Talha-Dean, Teymour [1 ,5 ]
Zhang, Yiyu [1 ]
Teo, Siew Lang [1 ]
Chai, Jianwei [1 ]
Bussolotti, Fabio [1 ,3 ]
Goh, Kuan Eng Johnson [1 ,3 ,6 ,7 ]
Lau, Chit Siong [1 ,3 ,8 ]
机构
[1] ASTAR, Inst Mat Res & Engn IMRE, Singapore 138634, Singapore
[2] Dept Chem, IIT Bombay, Mumbai 400076, India
[3] ASTAR, Quantum Innovat Ctr Q InC, Singapore 138634, Singapore
[4] Natl Univ Singapore, Dept Mat Sci & Engn, Singapore 117575, Singapore
[5] Queen Mary Univ London, Dept Phys & Astron, London E1 4NS, England
[6] Natl Univ Singapore, Dept Phys, Singapore 117551, Singapore
[7] Nanyang Technol Univ, Sch Phys & Math Sci, Div Phys & Appl Phys, Singapore 639798, Singapore
[8] Singapore Univ Technol & Design, Sci Math & Technol, Singapore 487372, Singapore
基金
新加坡国家研究基金会;
关键词
2D material; 2D semiconductor; subthresholdswing; field effect transistor; interface; transition metal dichalcogenide; van der Waals; ATOMIC LAYER DEPOSITION; SEMICONDUCTORS; TEMPERATURE; TRANSISTORS; AL2O3; MOS2; HFO2;
D O I
10.1021/acsnano.4c08554
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
Two-dimensional van der Waals semiconductors are promising for future nanoelectronics. However, integrating high-k gate dielectrics for device applications is challenging as the inert van der Waals material surfaces hinder uniform dielectric growth. Here, we report a liquid metal oxide-assisted approach to integrate ultrathin, high-k HfO2 dielectric on 2D semiconductors with atomically smooth interfaces. Using this approach, we fabricated 2D WS2 top-gated transistors with subthreshold swings down to 74.5 mV/dec, gate leakage current density below 10(-6) A/cm(2), and negligible hysteresis. We further demonstrate a one-step van der Waals integration of contacts and dielectrics on graphene. This can offer a scalable approach toward integrating entire prefabricated device stack arrays with 2D materials. Our work provides a scalable solution to address the crucial dielectric engineering challenge for 2D semiconductor-based electronics.
引用
收藏
页码:26911 / 26919
页数:9
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