Enhanced thermal constant B of diamond films for ultrahigh sensitivity negative temperature coefficient thermistors

被引:0
|
作者
Chen, Qiao [1 ,2 ]
Zhao, Yimeng [1 ]
Li, Jiawei [3 ]
Liu, Xiyuan [1 ]
Wang, Xinyue [1 ]
Zhang, Wenxi [1 ]
Zhu, Hongwei [3 ,4 ]
机构
[1] China Univ Geosci, Gemmol Inst, Wuhan 430074, Peoples R China
[2] China Univ Geosci, Shenzhen Res Inst, Shenzhen 518057, Peoples R China
[3] Tsinghua Univ, Sch Mat Sci & Engn, State Key Lab New Ceram & Fine Proc, Beijing 100084, Peoples R China
[4] Southwest United Grad Sch, Kunming 650500, Peoples R China
来源
关键词
polycrystalline diamond; thermistors; negative temperature coefficient; hopping conduction; grain boundary; ELECTRICAL-PROPERTIES; POLYCRYSTALLINE DIAMOND; FTIR SPECTROSCOPY; SINGLE-CRYSTAL; NITROGEN; MN1.2CO1.5NI0.3O4; CONDUCTIVITY; FABRICATION; BORON;
D O I
10.1007/s40843-024-3053-4
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Negative temperature coefficient (NTC) thermistor plays a crucial role in science research and engineering applications for precise temperature monitoring. Although great progress has been achieved in NTC materials, enhancing sensitivity and maintaining this high sensitivity along with linearity across extensive temperature ranges remain a significant challenge. In this study, we introduce a diamond-based thermistor (DT) characterized by its outstanding sensitivity, swift response time, and broad temperature monitoring capabilities. The temperature constant B for this DT, measured from 30 to 300 degrees C (B-30/300), achieves an exceptional value of 8012 K, which notably exceeds the temperature sensing capabilities of previously reported NTC thermistors within this extensive range. Moreover, diamond's unique thermal conductivity and stability significantly boost the response speed and durability of the DT, offering substantial advantages over traditional ceramic thermistors. The enhanced temperature-sensitive properties of the DT are attributed to the presence of impurity elements in polycrystalline diamond. Impedance analysis indicates a hopping conduction mechanism, likely involving C-H or C-N dipoles at the diamond grain boundaries. This study marks a significant leap forward in diamond thermistor technology and sheds light on the mechanisms of thermal active conduction in diamond materials.
引用
收藏
页码:3321 / 3329
页数:9
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