Towards Additively Manufactured Alumina Substrates for Printed Electronics Applications

In this paper, the usability of 3D printed aluminum oxide ceramic, as a substrate for printed electronics is examined. The typical manufacturing process of ceramic substrates is based on the pressing or casting of ceramic green bodies followed by firing, which are problematic technologies for the realization of 3D-shaped electronics. Therefore, the fused filament fabrication method is utilized for the realization of the alumina substrate. The manufacturing process is closely examined and observations are reported. A sufficient resistivity of 3.79E10(14) Omega.cm was measured. Onto 3D printed substrates, conductive structures based on Ag-filled paste were printed using Direct-Write digital printing technology. The adhesion force of printed layers was 35 N.mm(-2). The usability of a 3D printed alumina for electronics was further demonstrated by full circuit realization with components assembly.