Optimized Fabrication of Flexible Paper-Based PCBs with Pencil and Copper Electroplating

This research unveils a transformative methodology for fabricating flexible printed circuit boards (PCBs), focusing on the unique attributes of filter paper substrates. A meticulous parametric exploration scrutinizes critical aspects such as buckling resistance, charging current, plating time, and electrode configurations for copper electroplating. Key findings highlight the exceptional stability of copper electroplating on filter paper, exhibiting robust resistance against environmental variations and bending angles spanning +180 degrees to -180 degrees. Utilizing higher pencil grade material and maintaining a minimum 4 cm distance with a voltage range of 3 to 1.44 V ensures uniform, controlled plating without burning, optimizing the electrode area below 1 cm2 for enhanced practicality. The research underscores the longevity and durability of copper-plated filter paper, with negligible resistance changes even after 1000 folds. Over a year, the shelf-life assessment emphasizes the excellent stability of electroplated filter paper. Practical applications, including fully functional circuits and a bio-degradable piano, underscore the versatility and real-world feasibility of the proposed electroplating technique. This research introduces a method for fabricating flexible PCBs on filter paper substrates, highlighting its exceptional copper electroplating stability. Key parameters, including buckling resistance, electrode configurations, and voltage control, are optimized to achieve durable, uniform plating. The technique demonstrates minimal resistance change after 1000 folds and maintains stability over a year, enabling practical applications like functional circuits and a biodegradable piano. image